Strain–energy method for determining residual stresses in anodised thin films
نویسندگان
چکیده
منابع مشابه
Load Deflection Analysis for Determining Mechanical Properties of Thin Films with Tensile and Compressive Residual Stresses
An examination of load deflection (bulge) testing of coated and uncoated membranes by analytical and finite element methods was undertaken. The key parameters in the loaddeflection behavior of a membrane were non-dimensionalized and examined to illustrate how to design test structures for materials systems of interest. Experimental and modelling procedures were examined to improve measurement o...
متن کاملModeling of Residual Stresses in Thin Metal Films
Residual mechanical stresses introduced during deposition of thin films and coatings have a significant impact on the reliability of electronic devices and structural components. The mechanical stress in thin metal films consists of a thermal component and an intrinsic component due to the evolution of the metal microstructure during film growth. Controlling of the intrinsic stress component ha...
متن کاملINTERFACES AND STRESSES IN THIN FILMS p
ÐA review of the current understanding of the eect of interfaces on the intrinsic stresses in polycrystalline thin ®lms is given. Special attention is paid to the measurement, modeling and application of surface and interface stresses. Mechanisms for generating the compressive and tensile components of the intrinsic stress are assessed. Prospects for future research are presented. # 2000 Publi...
متن کاملResidual Stresses Measurement in Hollow Samples Using Contour Method
Residual stresses are created usually undesirably during manufacturing processes, including casting, welding, metal forming, etc. Residual stresses alone or in combination with other factors can cause the destruction and fracture of components or significant decline in their service life. Therefore, it is crucial to measure the residual stresses. Contour method is a destructive testing method c...
متن کاملResidual Stress Variation in Polysilicon Thin Films
This paper compares the use of four mechanical methods for characterization of residual stress variation in low pressure chemical vapor deposited (LPCVD) polysilicon thin films deposited, doped, and annealed under different conditions. Stress was determined using buckling structures, vibrating microstructures, static rotating structures and the wafer curvature method. After deposition of 1.0 μm...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Transactions of the IMF
سال: 2006
ISSN: 0020-2967,1745-9192
DOI: 10.1179/174591906x130310